It’s a massive supply chain, so, yes, both. But also a hundred other companies. TSMC and other foundries bring together many technologies from many companies (and no doubt a lot of their own) to ship a full foundry solution (design-technology-cooptimization, masks, lithography, packaging, etc).
The 3D Foveros packaging technology is critical as it allows some path lengths to be much shorter than if you had to traverse that same path but only in the horizontal 2D plane.
Very excited to see how this plays out in practice.
Yes, another anecdote to add to this thread of anecdotes is that my HI5 with HDA2 is stellar. I do hours at a time on highways in CA without a disengage.
6800U is awesome from what I’ve seen — better efficiency by far, and legit integrated graphics better than Xe — but it is vanishingly rare, even months after announcement.
The scale Intel has in manufacturing mobile CPUs is still unmatched.