The Race to Much More Advanced Packaging(semiengineering.com)

3 pointsby mrnode6 tahun yang lalu1 comments

https://semiengineering.com/the-race-to-much-more-advanced-packages/

1 comments

mrnode6 tahun yang lalu

Hybrid bonding opens up a big improvement in die-to-die performance, but getting there is not trivial.