Pretty much all ICs these days have builtin ESD protection which usually involves current steering diodes to supply rails.
So if you limit the input current (typically <5mA, and assuming the steered-to rail uses at least 5mA to sink it) it will survive any voltage.
(Of course if it's a low power design or the device is off this wont work that well, then you want external clamping)
I have tested 24V AC applied to an stm32f0 pin with a 10K series resistor and it survives that indefinitetly.
>For projects of any significant size, you're going to run into some constraint which requires you to use `make` differently than you have before.
That's precisley why official/standard build systems suck, they are extremly cumbersome to wrangle when you go off the beaten path.
So the irony is that standard build systems/package manager are whats good for hello worlds, non-trivial programs require custom build steps.
Just let me write a build.bat/build.sh per platform/compiler/configuration that are explicit and precise in compiler flags, paths, output files, pre/post processing, etc so nothing magical is happening under the hood.
Google and Apple are just a bunch of scrappy teams trying to work together on insanely massive and bloated code bases.
Numbers of bugs scale with lines of code.
Small scrappy team writing simple and consice code from scratch is likely to produce fewer bugs than enterprisey monstrosities.
esd cell -> optional pull ups/down -> schmitt trigger.