The Race to Much More Advanced Packaging(semiengineering.com)

3 ポイント投稿者 mrnode6 年前1 コメント

https://semiengineering.com/the-race-to-much-more-advanced-packages/

1 コメント

mrnode6 年前

Hybrid bonding opens up a big improvement in die-to-die performance, but getting there is not trivial.