One thing I'm curious about is whether this could change how cloud providers handle sensitive workloads.
If computation can happen directly on encrypted data, does that reduce the need for trusted environments like SGX/TEE, or does it mostly complement them?
I had heard similar cautions about ultrasonic cleaning with certain MEMS sensors, but I didn't realize the same concern could apply to exposed-die CMOS sensors as well.
Is the main risk the resonance frequencies of the bond wires, or more about mechanical stress propagating through the package?
I like the idea of turning the map into a kind of shared canvas. The fact that the strokes wrap around the 3D geometry instead of just being a flat overlay is a really nice touch.
Curious — how do you handle moderation or prevent drawings from turning into spam once more people start using it?
If computation can happen directly on encrypted data, does that reduce the need for trusted environments like SGX/TEE, or does it mostly complement them?