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"...for many companies this is a good idea. But just because something is a good idea for companies to do does not mean that it should be mandated by law."
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CoWoS stands for Chip on Wafer on Substrate. It is a high-density packaging technology for high-performance chips. TSMC developed CoWoS in 2012.
In CoWoS, multiple silicon dies are placed on a silicon interposer, which is an intermediate layer on the package board.
The interposer acts as a communication layer for the active die on top. CoWoS is a 2.5D packaging technology. It is widely used in high performance computing.
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> in particular, copper sulfide — were responsible for sharp drops in its electrical resistivity and a display of partial levitation over a magnet, properties similar to those exhibited by superconductors.