Dave Cutler created and ran the Windows NT product line through Windows 2000.
Other people ran Windows XP, but Cutler was still in charge of Server 2003 before moving on to special projects like creating 64 bit Windows and Microsoft Azure.
His attitude towards the eradication of known bugs really led to Windows feeling rock solid, with the exception of driver bugs (being the leading cause of blue screens).
Macs allow the machine owner to install (and boot) a completely unsigned OS on a different partition without having it affect security when you do boot MacOS.
The Mac partitions are encrypted by default and the system partition is signed and read only.
When the new leadership team took over, they announced that they would prioritize upstreaming the existing work over adding support for newer hardware.
Upstreaming their changes into the kernel took time.
Now the announced that they had started work on the M3 in February and things are progressing well.
> On top of the above, we also have PCIe, WiFi, Bluetooth, NVMe, keyboard, trackpad, and other core SoC block drivers working in Linux for M3 series machines. Most of this work has come by way of Yureka, who has been very busy hacking on both m1n1 and Linux with her M3 series machines for a while now. We still have a ways to go before we can start enabling Asahi Installer support for these machines, but progress is rapid so watch this space!
That sounds more like talented people doing meticulous work than doom.
They first mentioned that efforts to add M3 support were starting in February:
> For quite some time, m1n1 has had basic support for the M3 series machines. What has been missing are Devicetrees for each machine, as well as patches to our Linux kernel drivers to support M3-specific hardware quirks and changes from M2. Our intent was always to get to fleshing this out once our existing patchset became more manageable
Oddly enough, Samsung and SK Hynix decided that they needed to expand production on the same day another lawsuit accused them of colluding to keep production low and prices high.
> South Korea announces $520bn chip plant project with Samsung, SK Hynix
You can control which apps children can install, how much time they are allowed to use those apps a day, decide if they have access to the web, which web sites they can visit, and decide who they are allowed to communicate with.
What features are missing that makes everyone giving up their privacy a better option?
InFO combines chiplets, but does not do so by bonding multiple chiplets directly to a silicon interposer as CoWoS does.
The article compares CoWoS to InFO.
> CoWoS uses a passive silicon interposer—etched with thousands of fine interconnects—that sits between the active dies and the package substrate. This interposer provides high-density connections between chiplets and supports memory integration, most notably High Bandwidth Memory (HBM) stacks.
It also mentions that CoWoS is the tech used to build Nvidia's high end AI accelerators.
> AI Accelerators: Nvidia H100, B100 (HBM3 via CoWoS)
Apple is taking a tech that has previously only been used in very high end enterprise applications and is using it to make consumer SOCs starting with this years iPhone.
You can start by reading up on TSMC's name for the tech (although there are many versions at TSMC and TSMC isn't the only company packaging chiplets and memory on top of a silicon interposer).
Apple isn't just transitioning to TSMC's 2nm node, they are also transitioning to a chiplet based design using TSMC's advanced packaging.
> What sets the A20 apart isn’t just the node shrink—it’s the revolution in packaging. Apple is transitioning to Wafer-Level Multi-Chip Module (WLCM) integration, meaning that RAM will no longer be situated beside the chip, but rather on the chip wafer itself, integrated alongside the CPU, GPU, and Neural Engine.
This shift eliminates the need for silicon interposers and substrates, thereby enhancing signal integrity, improving thermal dissipation, and facilitating faster memory access with lower latency. The benefits? Better multitasking, smoother AI processing (hello, Apple Intelligence), improved battery life, and potentially a smaller chip footprint—freeing up space for other components.
> Multiple motherboard and PC component makers move forward with Chinese-made memory validation
https://www.pcgamer.com/hardware/memory/multiple-motherboard...
The only thing standing in the way of a major Chinese DDR5 ramp up is money.