We're not talking about achieving on-die chip speeds at the picosecond range here. We're talking about interface specifications between the CPU and the DRAM, USB, etc -- these things can be designed for based on specs, and you don't need a trise/tfall equal to 10% of your FO4 inverter delay to achieve this. These are board level specifications which can be achieved with medium tier off the shelf components. And if they can't be achieved at the latest DDRX specs, then just design for one generation behind to at least get something going in the community.